3M Anisotropic Conductive Film Adhesive (ACF) 73710 pages

Technical Data
August 2011
3M™ Anisotropic Conductive Film Adhesive (ACF) 7371
Product Description
3M™ Anisotropic Conductive Film Adhesive (ACF) 7371
Typical Physical Properties and
Performance Characteristics
is a heat-bondable, electrically conductive adhesive film.
Note: The following technical information and data should
The unbonded film is slightly tacky at room temperature
be considered representative or typical only and
and consists of a thermoset-elastomer and thermoplastic
should not be used for specification purposes.
adhesive matrix randomly loaded with conductive
Design Requirements
particles. These particles allow interconnection of circuit
Property
Units
100
(4)
micron
(mil)
Minimum Pitch
200
(8)
micron
(mil)
Minimum Pad Area
enough apart for the product to be electrically insulating
Value
Minimum Space Between
Conductors
lines through the adhesive thickness, but are spaced far
0.1
(160)
sq. mm
(sq. mil)
in the plane of the adhesive. Application of heat and
pressure causes the adhesive to flow and to bring the
circuit pads into contact by trapping the conductive
particles. The adhesive rapidly cross-links at modest
bonding temperature and pressure. 3M ACF 7371 may be
Ambient Physical Properties
used to bond a flexible printed circuit to another flexible
Property(1)
Property
Adhesive Type
Gold-Coated Polymer
Particle Size
Polyester Film with Silicone Release
Adhesive Thickness
25 micron
Liner Thickness
50 micron
Flex-toAg-Ink/Pet(4)
< 20 mOhms
3M TM-2314(3)
Flex-toITO/PET(5)
> 700 gf/cm
3M TM-2313(6)
Flex-toAg-Ink/Pet(4)
> 600 gf/cm
3M TM-2313(6)
Flex-tobare-PET(7)
> 900 gf/cm
3M TM-2313(6)
10 micron
Liner Type
3M TM-2314(3)
Thermosetting Type
Particle Type
< 20 mOhms
Peel Strength
Value
Flex-toPC board(2)
Peel Strength
General Properties
Test Method
Peel Strength
Construction
Value
Interconnect
Resistance
panel display device.
Test Substrates
Interconnect
Resistance
printed circuit or to a plastic touch screen or plastic flat
(1)
(2)
(3)
(4)
(5)
(6)
(7)
For a given application, values may differ depending on particular substrate
material or type of circuitry.
Measured for gold/nickel/copper polyimide flex circuits bonded to printed
circuit board. Contact overlap area was 0.38 sq. mm. Pad pitch was 500
microns.
3M internal test method TM-2314 based on IPC 650 - Section 2.6.24. The
flex has the shorting strap located near the bond-line to approximate a
4-wire test structure and eliminate most extraneous resistance in the
measurement due to the circuit lines.
Measured for gold/nickel/copper polyimide flex circuits bonded to silverink/indium-tin-oxide/polyester. Contact overlap area was 2.0 sq. mm. Pad
pitch was 2 mm.
Measured for gold/nickel/copper polyimide flex circuits bonded to indiumtin-oxide/polyester. Flex circuit pitch was 500 microns.
3M internal test method TM-2313 based on IPC 650 - Section 2.4.9.1.
Measured for gold/nickel/copper polyimide flex circuits bonded to bare
polyester. Flex circuit pitch was 2 mm.
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