TropoSPHERE Plasma System0 pages

TropoSPHERE™ Plasma System
Features and Benefits

Dual cassette load stations to minimize
idle time
Multi-size capable aligner with minimal
hardware change-over required
Robust robotic wafer engine
Integrated wafer recognition for high
reliability wafer handling
Compact design minimizes floor space
Unique kits allow fast change-over
between wafer sizes and supports multiload for smaller wafer sizes
Highly uniform treatment and fast
throughput

Superior Plasma Technology for High
Throughput Wafer Processing
The TrophoSPHERE™ system is designed for highthroughput processing of semiconductor wafers (and other
flat substrates) in sizes ranging from 76 mm (3 in.) to 200
mm (8 in.) in diameter, for wafers held in open cassettes.
The patented plasma chamber design provides exceptional
etch uniformity and process repeatability. Primary plasma
applications include a variety of etching, ashing, and
descum steps. Other plasma processes include
contamination removal, surface roughening, increasing
wettability, and enhancing bonding and adhesion strength.
Application
Wafer processing prior to typical back-end packaging steps
– suitable for wafer-level packaging, flip-chip, or traditional
packaging.
High Throughput Processing
The TropoSPHERE system’s integrated semiconductor
wafer handling system provides rapid material transfer for
a wide range of wafer sizes. Processing can be done from
most types of wafer cassettes.
The patented chamber design and control architecture
enables short plasma cycle times with very low overhead,
ensuring that throughput for your application is maximized
and cost of ownership is minimized.

Wafer Cleaning

Remove contamination prior to wafer bumping
Remove organic contamination
Remove fluorine and other halogen contamination
Remove metal and metal oxides
Improve spun-on film adhesion
Clean metallic bond pads

Wafer Etching

Descum wafer of residual photoresist / BCB
Pattern dielectric layers for redistribution
Strip / etch photoresist
Enhance adhesion of wafer applied materials
Remove excess wafer applied mold / epoxy
Enhance adhesion of gold solder bumps
Destress wafer to reduce breakage
Improve spun-on film adhesion
Clean Aluminum bond pads