Data sheet DZA-S7030-40 pages

Preamplifier Electronics for
Hamamatsu Back-thinned / Back-illuminated
CCD Sensors series S703x and S717x
In der Au 27
61440 Oberursel / Germany

DZA-S7030-4
DZA-S7030-4-S Version 1.3

Product-IDs: 06230.13(-S), 06231.13 (-L), 06232.13(-P); 06233.10(-tc)
Document: ds_dza-s7030-4_111e.doc

Phone: +49 (0) 6171 / 9758 – 0
Fax: +49 (0) 6171 / 9758 – 50
E-Mail: sales@tec5.com
Internet: www.tec5.com

The unit consists of the following printed circuit boards:
• a Sensor PCB (DZA-S7030-4-S)
• a Logic PCB (DZA-S7030-4-L)
• a Power Supply PCB (DZA-S7030-4-P)
• an optional Cooling Controller PCB
(DZA-S7030-4-tc)
The Logic and Power Supply PCBs may be combined
mechanically to a board format of 135 mm x 100 mm for
easier mounting into standard housings or frames. In
most applications, the CCD array is directly plugged
into the 24 pin DIL socket mounted to the soldering side
of the Sensor PCB.
The interface for the Front End Electronics complies to
tec5 specification ‚Sensor_U2’ (14 pin header connector
for PDA control signals and SMB flange socket with pin
contact or 4 pin MICS-4 connector for differential video
signal) for direct interconnection to FEE-1M.

DZA-S7030-4
for Carl Zeiss MCS Spectral Sensors

Short Description
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Preamplifier board set for Hamamatsu backthinned / back-illuminated CCD Sensors
series S7030, S7031, S7033, S7034 and
series S7170, S7171
Optional Peltier cooling controller
Single supply +12 V operation
Input from device: CCD sensor
Output to device: Front End Electronics with
sensor interface ‚Sensor_U2’

For use with MCS spectral sensors from Carl Zeiss,
equipped with a compatible CCD sensor, the Sensor
PCB can be plugged directly onto the CCD array integrated in the spectrometer and is fastened to the spectrometer housing by means of two screws.

Features

General
The Preamplifier Electronics DZA-S7030-4 serves as
an adaptation subassembly matching the Hamamatsu
back-thinned / back illuminated CCDs series S703x and
S717x to a Front End Electronics unit of a tec5 Operating Electronics (i.e. FEE-1M).
to FEE
0.5 m max.

Supply
+ 12V DC
Digital control

Video

plugged
or 0.2 m
typ.

Cooling PCB
100mm x 60mm
(optional, plug-on)

0.2 m
typ.
plugged
or 0.2 m
typ.

Logic PCB
100mm x 75 mm

34mm x 19mm

Sensor PCB
68mm x 45 mm
Power PCB
100mm x 60 mm
Peltier current, thermistor
0.5 m max.

Fig. 1: Configuration of DZA-S7030-4

Modes of operation
• Standard mode “line binning” (summing the vertical pixels), reading the array like a linear array
• Various alternative modes are supported by the
DZA-S7030-4 (binning and imaging), depending
on system configuration.
Please contact tec5 for details.
Signal processing
• Operation in MPP-mode defined by Hamamatsu,
optimizing dynamic range
• Correlated Double Sampling
• Differential video output
Cooling (optional)
• Four quadrant PI cooling possible
with optional cooling board
• Automatic detection of excess detector temperature and disabling of cooling
• Analog setpoint input and monitor output
Configuration and monitoring
• Configuration and mode selection alternatively
2
via I C bus or solder gaps
2
• Error monitoring via I C bus or LED’s
• Fast hardware error signal available