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Esec Programmable Ultrasonic Module (PUM)0 pages
Esec Programmable
g
Ultrasonic Module (PUM)
Advantages in Your Production
IGBT
Power
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SO
MOSFET
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SIP
TO-247
IC
power
gh
Hi
The new Programmable Ultrasonic Module (PUM) meets these
challenges, combining solder pattern writing with enhanced
wetting by applying ultrasonic energy to the liquid solder. While
the amount of solder is precisely controlled with the dual wire
dispenser, the geometry of the final solder pattern is the result of
a writing movement of the ultrasonic transducer tip. Both are part
of the product recipe, making the solder pattern easily reproducible.
Future Proof Equipment
St
PQFN
F
SOT
T
TO3P
r
The dimensions of the solder pattern are crucial for good process
quality. Good control of bond line thickness (BLT) and solder
distribution, minimum die to pad and die to die distance are difficult
to achieve. Besides that, some new Zn based high temperature
Pb-free solder materials are more difficult to dispense properly due
to their wetting behavior.
Pow
er
Superior Process, Drastically Reduced
Tooling Costs
and
a rd
po w
e
TO
DPAK
Solder pattern size and target BLT adjusted
without tool change
Full pad coverage, no geometrical limitations
Superior wetting with US power
Small and well distributed voids
Upgradeable on Esec 2009 SSIE and Esec 2009 fSE
NEW
PATTERN
DISPENSING
SAME PROVEN
OVEN &
ATMOSPHERE
Patent Pending
SAME
PROVEN WIRE
DISPENSE
PROCESS
SAME PROVEN
BOND PROCESS
www.besi.com
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