Esec 2100 hS0 pages
Esec 2100 hS
The Next Generation High Speed Die Bonder
The Esec 2100 hS is the first model of the 2100 Die Bonder GEN3
family featuring yet another engineering master piece.
Future Proof Equipment
A new Pick & Place generation using a “light & rigid” structure, which
in conjunction with advanced trajectory control and optional Liquid
Cooling, delivers a significantly higher performance.
In addition, a new versatile Substrate Handler Family is introduced
adapting to all needs of High Speed Epoxy Die Bonding.
The Esec 2100 hS is a highly scalable High Speed Die Bonder providing
the best possible Cost of Ownership (CoO).
MEMS
QFN
SiP
Other
Process Quality at Highest Speed
•tProductivity up to 18 500 UPH
•tStandard accuracy: 20 µm @ 3 σ
•tHigh Accuracy Mode: 15 µm @ 3 σ
•tVersatile substrate handler concept
•tScalable performance & application range
•tHighest uptime
GEN3
TECHNOLOGY
SPEED &
ACCURACY
GEN3
DUAL
DISPENSING
Esec 2100
SCALABLE &
CONFIGURABLE
www.besi.com
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