V10-G0 pages

Plasma technology

Low-pressure plasma system V10-G
Efficient batch system for removal of photoresist
The batch system V10-G is designed for
the removal of photoresists. Furthermore
it can be optimally used for the cleaning
of wafers.

The low-pressure plasma
system V10-G is equipped with
a sliding door and a process
chamber made of quartz glass
and is also suitable for the
cleaning of wafers.

Areas of application
•• Ideal system for removing photoresist
t layers (also SU-8) after dry processes like
t RIE or Ion Beam etching as well as after
t high dose implant processes
•• Silicon wafers or other substrate cleaning
t prior wet processing to achieve a better
t wettability for an uniform and efficient
t result
•• Applicable for processes in MEMS and
t nanotechnology
•• Polymer removal e.g. after
t Bosch processes
•• Removal of organic sacrificial layers
•• Conditioning of bioactive compounds

System features
•• Process chamber: quartz glass
•• Sliding door
•• PLC control: SPS (S7-300)
•• Resistive touch screen panel
t with Windows operating system
t (also operable with gloves)
•• Automatic and manual operation
•• Display of all process relevant parameters
•• Individual access authorization
t via user groups
•• Archiving of all processes
•• Remote maintenance (VPN)
•• Ethernet interface
Options
•• Vacuum pump
•• Ozone trap
•• Up to two additional gas inlets
•• Soft start and slow vent
•• Faraday cage
•• Process pressure control valve

Technical data
Dimensions of the system (W x D x H): 720 x 820 x 820 mm
Dimensions of the chamber (Ø x D): 215 x 260 mm
Plasma excitation frequency: Microwave (2.45 GHz)
Microwave power: 50-600 W
Gas inlets with mass flow controller: 1 channel
Power supply: 400 V, 50 / 60 Hz
Power input (without vacuum pump): 1.5 kVA
Vacuum gauge: Pirani
Weight: 150 kg

PINK GmbH
Thermosysteme
Am Kessler 6
97877 Wertheim
Germany
T +49 (0) 93 42 919-0
F +49 (0) 93 42 919-111
plasma-finish@pink.de
www.pink.de