Heat Sink COOL1000 pages

Advanced Research & Technology in Photonics
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Doc-Id:LDS003
The heat sink COOL100 was designed for temperature stabilization of high power laser diodes, laser arrays and laser
stacks of about 100W optical power. Depending from the temperature difference between laser diode and ambient air the max.
heat load is up to 250W.
A heat sink includes the metal block, fans for the heat dissipation, the peltier elements (TEC's), a heat spread plate with a
temperature sensor, the laser diode cable and the cooler cable.
For using laser diodes with integrated peltier elements and temperature sensor the heat sink is available without peltier
elements, temperature sensor and heat spread plate for a reduced price.
Heat Sink COOL100
.. Up to 250W heat load
.. High temperature accuracy
.. Peltier driven, air cooling
.. Available with or without peltier elements, temperature sensor and
heat spread plate
.. LD- and Cooler-cable included
Temperature stabilization of passively cooled high power laser
diodes, laser arrays and laser stacks up to about 100W optical power
Features
Applications
For example with 110W laser diode.
With peltier elements and without heat spread
plate.
Description
Specifications
Thermal Characteristics COOL100
Heat Load (max) with a temperature difference between laser diode module and ambient air of
0 K 250 W
5 K 180 W
10 K 120 W
Tmax (hot side) 50°C
Temperature Difference 40 K
Thermal Resistance 0.07 K/W
Electrical Characteristics
Temperature Sensor NTC 10 kOhm
Peltier Current 0…±13 A
Peltier Voltage 0…±48 V
Fan Current 1,0 A
Fan Voltage 12 V
General Characteristics
Ambient Temperature 0…30°C
Relative Humidity 30…70 %
Weight 5 kg
Dimension (w x d x h) in mm3 270 x 280 x 130
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