MCP Product FlyeR0 pages

Micron® Multichip Packages
A Perfect Match
for Matchless
Performance
Form Factor, Speed, Power—
Get It All with Micron MCPs
With Micron’s MCPs, you can mix and match devices,
configurations, and package options and find the just-right
combination of low power, high reliability, and overall robustness.
Small Form Factor: Thin is in for wireless and handheld consumer
products. Make your designs match with fully tested, stackable,
chip-scale packaging solutions are available in Mobile LPDRAM,
Mobile LPDRAM/NAND, Mobile LPDRAM/NAND/e•MMC™,
Mobile LPDRAM/PSRAM/NOR, and PCM/LPDDR2 combinations.
Speed: Our industry-standard NAND Flash offers highperformance features, including a READ CACHE function that
can be used to stream more than 30 MB/s; our Mobile LPDRAM
achieves data transfer rates of 400 Mb/s and delivers clock
speeds of up to 200 MHz; and our NOR Flash memory reaches
up to 133 MHz operating in burst mode.
Low Power: Our Mobile LPDRAM devices with inherently low
self refresh current are excellent battery-life extenders. A deep
power-down option available on NOR MCPs significantly reduces
power consumption.
Chipset Validation: Our high-performance MCPs are validated
by many chipset vendors on the most recent boards, enabling
them to perform to their fullest potential.
Contact Us
Get more information on our Web site at
www.micron.com/products/mcp.
micron.com
Products are warranted only to meet Micron’s production data sheet specifications.
Products and specifications are subject to change without notice.
Micron and the Micron logo are trademarks of Micron Technology, Inc. e-MMC is a trademark of the
MultiMediaCard Association. All other trademarks are the property of their respective owners. ©2009
Micron Technology, Inc. All rights reserved. 8/12 EN.L
4 Reasons Why
Micron’s MCPs
Are a Perfect Match
1. Technical Support
Streamline time-to-market with experienced,
market-specialized design support.
2. Custom Software Support
Design with confidence knowing that we’ve anticipated the technical challenges and collaborated with
chipset vendors and operation system engineers to
solve them.
3. Compact Footprint
Enable ever-smaller and sleeker product designs
with small footprints and low heights.
4. Broad Portfoliot
Maximize feature set and functionality with Micron’s
comprehensive MCP portfolio.