BJ8200 pages

HESSE

MECHATRONICS

Thin Wire Wedge Bonder

Bondjet BJ820

The BONDJET BJ820 is an innovation of the

Hesse GmbH for the thin wire wedge bonding

market. All challenging wire bonding applications can

be handled on a single platform - RF and microwave

devices, COB, MCM and hybrids, fiberoptics and auto-

motive using aluminium or gold wire or ribbon.

High Speed Fully Automatic

Thin Wire Wedge Bonder

Precision

1 urn at 3 a axis repeatability

High precision touchdown detection without time delay

Precise control of bond force (1 cN)

Flexibility

Largest bonding area: 305 mm x 410 mm (12" x 16.1")

»• Can serve with two or more smaller bonding stations

for efficient handling of smaller products or substrates,

eliminating indexing time and maximizing throughput

(with indexers as well as with manual loading)

»- Enables intelligent automation of extra large products

Speed

Up to 7 wires per second

Quality

»• Realtime bond quality monitoring system

Wear free and almost maintenance free piezo bondhead

with solid state hinges

The PBS200 software supports control by host

computer, product traceability and external statistical

analysis

Process integrated Quality Control (PiQC) for advanced

quality monitoring

E-box: patented solution for optimized tool change

and programmable alignment marks for guide, cutter

and bond wedge

Small Footprint, Big Capability

Integrates easily into complex production lines

Process Advantages

Loop length: 70 urn up to 20 mm

»• Various loop form functions

Constant wire length

Constant loop height

Individual loop shapes

Fine pitch capability < 40 Mm