Adhesives advertisement0 pages

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Electronics

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Solutions

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DOW CORNING

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Dow Corningf EA-6052 Fast Low-Temp Cure Adhesive and

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Dow Comincf EA-6054 Thixotropic Fast Low-Temp Cure Adhesive

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Be fast. Be cool.

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Cut Costs.

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New low-temp, fast-cure adhesives offer throughputs

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up to three times faster than the industry standard.

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Speed up your processes or turn down the heat with a new generation of low-

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temperature, fast-cure silicone adhesives from Dow Corning. Reduce cycle times,

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energy consumption, and even floor space, while producing a better performing

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seal. This breakthrough adhesive technology from Dow Corning offers you

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options for fast process savings.

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Faster cure time for faster throughput

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Fast curing shortens cycle times, enabling the production of more modules in

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the same amount of time. Accelerated curing also allows use of ovens that are

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shorter and require fewer fixtures than standard ovens, reducing start-up capital

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costs. Shorter ovens have a smaller footprint, freeing up floor space for other

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operations.

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Lower temperatures for reduced operational costs

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With lower cure temperatures than the industry standard, these products allow the

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use of low-cost plastics that cannot be used with adhesives that have higher cure

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temperatures, even while keeping processing times competitive.

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Improved performance for demanding applications

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These fast-cure adhesives provide more choices, enabling manufacturers more

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durable solutions for safeguarding sensitive electronic components in extreme

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environmental conditions. These silicone products retain their elasticity, ensuring a

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reliable seal. And the adhesives rapidly adhere to industry-critical substrates such

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as polyamide, PBT ceramics and aluminum.

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Low voiding for increased reliability

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Bubbling caused by evaporated water in plastics and nylon during cure can cause

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voids and prevent reliable sealing. The low-voiding characteristic of these adhesives

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provides better moisture tolerance and the low-cure temperature can minimize the

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evaporation or boil-off of the water from the plastic, eliminating the need to dry the

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plastic components.

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Solutions for every need

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Whatever the need, from sealing lids and housings, attaching base plates orgasket-

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ing applications, to connector sealing and multiple plane dispensing, this new adhe-

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sive technology from Dow Corning has you covered - and it's available in flowable

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and thixotropic formulations.

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To learn about your best solution, visit our website at

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www.dowcornina.com/electronics.

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Features and

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Benefits

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Fast Low-Temp Cure Adhesives

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« 2-part, 1:1 mix ratio

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« Reduced voiding

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« Rapid low-temperature cure

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+ UV indicator for automated

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inspection

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« Noncorrosive

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Dow Corning EA-6052

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Fast Low-Temp Cure Adhesive

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« Flowable to allow channel

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filling

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Dow Corning EA-6054

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Thixotropic Fast Low-Temp

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Cure Adhesive

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4 Non-slump, thixotropic

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formulation enables

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dispensing on multiple

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planes

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