B_HSS32350 pages

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Selective Soldering System

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HSS 3235

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Selective Soldering with Short Cycle Times

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Selective soldering of leaded devices and connec-

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tors after reflow.

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Simultaneous processing assures short cycle

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times (15-20 sec. depending on application).

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High process reliability because of large solder

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volume and a closed loop wave height control.

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Flexible system concept.

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Bare board handling or processing of carriers

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possible.

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Ideally suited for inline processes.

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Area of Application:

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Selective Soldering with Short Cycle Times

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The HSS 3235 (High-volume Selective System) is ideal, as

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a supplement to reflow processes, to solder leaded com-

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ponents or connectors. This applies specifically when

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short cycle times are required for large volume production.

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Both, bare boards as well as carriers can be processed

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and of course the HSS 3235 may be integrated into a fully

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automated production line.

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The Individual Modules and Process Steps:

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Depending on the size of PCB to be soldered, the HSS

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3235 feeds one or more assemblies into the different

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machine areas: fluxer, preheating or soldering area. In

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each case, all joints will be fluxed, preheated or soldered in

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parallel and at the

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same time which

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guarantees shortest

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cycle times.

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Additionally, the HSS

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3235 is equipped

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with a segmented

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conveyor system,

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allowing individual

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profile settings.

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Let's first have a look on the first process step: fluxing. The

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cycle time in this area is independent from the number of

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solder joints, as all joints will be fluxed simultaneously.

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Depending on your application, a stamp fluxing system or

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a coordinate spray fluxer may

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be integrated. The product-

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specific tools which are used

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for the stamp fluxer of course

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are quickly exchangeable.

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Optionally, a programmable

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coordinate fluxing unit can be

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installed to avoid change-over

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times. Micro drop jet nozzles

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guarantee minimum flux resi-

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dues.

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The preheating zone consists of heating modules with IR

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emitters and may be supplemented with a convection

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heating module. This guarantees an efficient and very

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homogeneous heat transfer.

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