Dow Corning Plasma Solutions0 pages

Dow Corning Plasma Solutions’ unique
and proprietary use of liquid precursors
within the plasma provides profound benets
unmatched by other plasma providers.
Dow Corning Plasma
Solutions technology
delivers:
• Enhanced product
performance and/or new
product development
through custom surface
functionalisation
• Reduced processing
costs through replacement
of wet- and heat-based
systems
• Health, safety and environmental benets from
a process that is dry and
energy efcient with low
raw material consumption
and waste
Dow Corning
Plasma Solutions
As a highly aggressive medium that attacks and breaks up molecular species, the use
of plasma to put down functional coatings has historically been limited to elements
or low molecular weight compounds. Because of this, outside of highly specialised
applications able to use these simple coatings (such as microelectronics), industry has
been slow to widely adopt plasma processing despite its many advantages.
Meeting customers’ needs
Innovative technology from Dow Corning Plasma Solutions has removed the roadblocks to coating sophistication, functionality and value so that a wide range of
super-functional, high molecular weight, and even bio-functional, nano-coatings can
now be delivered to meet customers’ needs.
Like nothing else out there
Unlike other plasma surface engineering techniques that rely upon gas state precursors or apply liquid to the substrate either before or after (but not in) the plasma,
Dow Corning’s nano-coating process sprays atomised droplets of liquid precursor
directly into the room-temperature plasma at atmospheric pressure. The liquid
precursor supplies the chemistry while the plasma polymerises, crosslinks and bonds
the precursor to the surface to deliver the functional coating.
Dow Corning Plasma Solutions’ unique and proprietary use of liquid precursors within
the plasma provides benets unmatched by other plasma providers:
• Because the number of liquid state precursors is vastly higher than gas state precursors, Dow Corning’s technology provides users with a larger range of surface
engineering chemistries and properties than other surface engineering techniques.
• The coating rate is much higher than that of gas plasmas, ensuring high throughput and reduced cost.
• The delivery of liquid droplet precursor at atmospheric pressure protects the
precursor at the molecular level from damage, destruction and denaturing by
the plasma.