CE |HS Reflow system | HB AUTOMATION0 pages

The HB Advantage

H B A U T O M AT I O N

• HB has a long tradition of providing quality equipment and service
• With an extensive and knowledgeable service network in North and South America, service and support are not far away
• Best in the industry warranty – 5 years for the heaters, blowers and solder pot - 2 on all other parts
• Lifetime free software upgrades
• Lifetime free training at any HB factory

Model
Number of heating zones

HS-0601
Top 6/ bottom 6

HS-0802
Top 8/ bottom 8

HS-1002
Top 10/bottom 10

HS-1202
Top 12/bottom 12

Length of heating zones(mm)

2995

3121

3891

4706

Number of cooling zones

Top 1 / bottom 1

Top 2 / bottom 2 Forced air cooling

Nozzle plate
Exhaust volume

Aluminum alloy plates
1200CFM (400CFM per port)

10M2/min *2 channel exhaust

HS series
of Lead free reflow soldering system

Control system
Power supply requirements
Power consumption

3 phase ,380V 50/60Hz ( optional : 3 phase ,220V 50/60V)
7KW
9KW

Warming time
Temp. setting range

< 15mins
Room temperature to300°C

Temperature control method

PID Close loop control +SSR Driving

Temperature control precision
Temperature deviation on PCB
Conveyor system
Chain structure

+/- 1.0 °C
+/- 1.5°C ( by HB test standard )
Single buckle

单位
Single buckle for preventing board jammed

Max. PCB width

400mm

400mm ( Optional 610mm )

Range of rail width

50-400mm

50mm -400mm (optional 50mm -610mm )

Components clearance
Conveyor direction
PCB transmission method
Conveyor speech

Top/Bottom clearance of PCB : 25mm
L to R ( Optional R to L )
Chain + Mesh
300mm /min-2000mm / min

lubrication

Auto-lubrication / Manual-lubrication

Optional

Full N2 system, Center support system ,KIC RPI reflow process inspection ,Dual lane

10KW

11KW

30 minutes
Room temperature to 300°C

Microsoft

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